Hefei Smat Technology Co., Ltd. is located at No. 3699 Xiyou Road, High-tech Zone, Hefei. With an initial registered capital of 505 million yuan, the company adheres to the principle of "technological innovation and independent research and development" and aims to become a leading enterprise in the field of advanced packaging and testing for integrated circuits. The company specializes in the research, development, and production of advanced packaging for integrated circuits.
Company establishment date
A patented project that has been applied for.
The company boasts leading R&D capabilities in China, with an industry-leading R&D team in the field of advanced packaging. It has applied for 168 patents, and based on its proprietary technologies, it constructed the first production-capable substrate-level fan-out packaging line in China in 2019. The company's product packaging mainly includes system-level packaging, three-dimensional module packaging, fan-out DFN packaging, new sensor packaging, and six-sided encapsulated CSP packaging, providing customers with more reliable, high-performance, and compact packaging solutions for integrated circuit products.
The company has obtained certifications for ISO 9001, ISO 14001, ISO 45001, QC 080000, IATF 16949, as well as the certification of "National High-tech Enterprise." Additionally, it has received numerous awards and honors in various significant professional fields.
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