SMAT-USA001

SMAT-USA002

LED and IC high-density integrated packaging structure and LED light strips

A Bump Structure and a Chip Package Incorporating This Structure

Fan-out chip packaging method and fan-out chip package

A plastic-sealed component and its process method for filling gaps without voids

A layered isolation packaging structure for large-size chips

A layered-prevention encapsulation structure

Three-sided metal-encapsulated packaging structure

Five-sided metal-encapsulated packaging structure

Side-wall exposed copper packaging structure

Encapsulation Structure and Manufacturing Method for Pressure Sensors

Encapsulation body

Multi-chip stacked package

Chip Packaging Structure

Enhanced Heat-Dissipation Package

Chip Packaging Structure

Universal substrate tray

Mold for plastic encapsulation and the encapsulated product molded using this mold

Chip Packaging Structure

A new type of multi-window PCB plating fixture

Carrier and chip packaging structure employing the carrier

Highly conductive, low-resistance chip packaging structure

Electromagnetic Shielding Packaging Components and Their Manufacturing Method

Stacked Chip Packaging Structure

Chip packaging methods and packaging components

Encapsulation Structure and Encapsulation Method

Stacked Chip Packaging Structure

Chip Mounting Equipment

Chip Flip-Chip Mounting Equipment

Chip-on-board mounting equipment

Flip-chip packaging structure

Chip Picking Equipment

Chip Pickup and Placement Device

Encapsulation structure with low warpage

A chip packaging structure

A bond-pad-outlined MOS chip structure and its packaging method

An inductor packaging structure and its packaging method

Three-sided metal-encapsulated packaging structure and its preparation method

A semiconductor packaging structure, device, and its packaging process

A chip packaging cutting and rework method

A chip packaging structure and its manufacturing method

A pretreatment method for copper deposition and a chip packaging process

A packaged shielding structure and its packaging process

A test track and testing equipment for chip packaging units

A new type of multi-window PCB plating fixture

Highly conductive, low-resistance chip packaging structure and its preparation method

Universal substrate material box

A packaging method for chip encapsulation

A layered-prevention encapsulation structure and encapsulation process

A layered isolation packaging structure and process for large-size chips

Enhanced Heat-Dissipation Package and Its Fabrication Method

Multi-chip stacking packaging method and package assembly

A roller structure for encapsulation body electroplating, along with an electroplating apparatus and method.

Chip packaging methods and packaging structures

Encapsulation Structure and Encapsulation Method

Chip Mounting Equipment and Methods for Chip Mounting

A gas atmosphere protection device for assisting dry film application, along with a laminating machine

An inductive chip packaging structure, process, and semiconductor device

A packaging structure and process for an MOSFET chip

A packaged structural design and chip device

An overflow-proof packaging structure and its die-attaching method

A semi-finished structure, device, and packaging process for a high-power chip

A flip-chip surface-mounted packaging structure, process, and semiconductor device

A pre-fabricated substrate for stencil-printed soldering in encapsulation bodies

A pre-encapsulated substrate

An exposed-wire-chip package and its manufacturing method

A chip cooling structure, process, and semiconductor device

A circuit module packaging structure

A high-voltage chip packaging structure

A chip-peeling mechanism, a peeling machine, and a peeling method

Multi-chip stacked package

Encapsulation body

Encapsulation body

Stacked packaging method for voltage regulators and the corresponding stacked packaging device

A multi-chip packaging structure and its packaging method

A multi-component chip packaging structure

A flip-chip packaging method

A multi-component chip packaging structure

Encapsulation Structure and Manufacturing Method for Pressure Sensors

Stacked Chip Packaging Structure

Stacked Chip Packaging Structure