Independent research and development<br/>of scientific and technological innovation

Independent research and development
of scientific and technological innovation

Focus on advanced semiconductor packaging,
with FOPLP technology as the core

Walking into SMAT

First substrate-level fan-out packaging process with mass production capabilities in China

Hefei Smat Technology Co., Ltd. is located at No. 3699 Xiyou Road, High-tech Zone, Hefei. With an initial registered capital of 505 million yuan, the company adheres to the principle of "technological innovation and independent research and development" and aims to become a leading enterprise in the field of advanced packaging and testing for integrated circuits. The company specializes in the research, development, and production of advanced packaging for integrated circuits.

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2015 year

Company establishment date

200 +

A patented project that has been applied for

视频标题

LATEST RELEASE

TVS

DFN appearance Flat foot and convex foot design Can be exposed to tin on the side High overcurrent capability The chip size can be increased by 20% relative to the WB structure Small packaging parasitic capacitance (<0.1pf)
TVS

MOS

DFN appearance Flat foot and convex foot design Can be exposed to tin on the side Low RDSON High heat dissipation capacity Smaller package size
MOS

NEWS

The company is mainly engaged in the research and development, production and sales of advanced packaging of integrated circuits. 

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SMAT Technology focuses on the 10th China Manufacturing Power Conference: Rooted in Reality, Sharing the Path to a New Era in Industry.

SMAT Technology focuses on the 10th China Manufacturing Power Conference: Rooted in Reality, Sharing the Path to a New Era in Industry.

2025.12.28

10:15–10:17 Shenzhen Bay Chip Exhibition

10:15–10:17 Shenzhen Bay Chip Exhibition

Guiding Organization: China International Engineering Consulting Co., Ltd. Organizing Entities: Shenzhen Semiconductor and Integrated Circuit Industry Alliance (SICA), Shenzhen Major Industry Investment Group Co., Ltd.

2025.10.08

Preview of the 9th China System-in-Package Conference (SiP Conference China 2025)

Preview of the 9th China System-in-Package Conference (SiP Conference China 2025)

The China System-in-Package Conference is the largest and most influential international conference and exhibition in China focusing on system-in-package technology. It brings together top experts, scholars, business decision-makers, and engineers in the global SiP field to discuss technology trends, share the latest achievements, and showcase innovative products and solutions. It is an important platform for connecting the industrial chain and promoting cooperation.

2025.07.18

Comprehensive Analysis of Integrated Circuits: From Functionality to Fabrication, Mastering All Key Points

Comprehensive Analysis of Integrated Circuits: From Functionality to Fabrication, Mastering All Key Points

An integrated circuit, abbreviated as IC, is a circuit that integrates multiple commonly used electronic components, such as resistors, capacitors, and transistors, and their connecting lines, together through advanced semiconductor manufacturing processes. This circuit has specific functions and is widely used in various electronic devices.

2025.06.12

Nine Years of Silicon Journey, Surmounting the Peak of 'Heart'---Si-mai Technology Annual Meeting Successfully Held

Nine Years of Silicon Journey, Surmounting the Peak of 'Heart'---Si-mai Technology Annual Meeting Successfully Held

As time marches on, January 17, 2025, arrived quietly, and the annual meeting of Si-mai Technology kicked off as scheduled. It was not merely a simple celebratory dinner, but a grand celebration where all Si-mai people joined hands to look forward to the future.

2025.01.20

SiMa Microelectronics General Manager Tan Xiaochun: Substrate fan-out packaging technology and applications

SiMa Microelectronics General Manager Tan Xiaochun: Substrate fan-out packaging technology and applications

Tan Xiaochun, General Manager of Hefei Si Mai Microelectronics Technology Co., Ltd., shared the characteristics and advantages of fan-out packaging structure, the opportunities and challenges facing fan-out packaging, and application cases of Hefei Si Mai's fan-out packaging in a presentation titled "Fan-out Packaging Technology and Applications".

2022.11.25

CONTACT US TO LEARN MORE

WeChat Official Account

WeChat Official Account

0086-17755163133 (Mr. Fu/Ben)

ben_fu@smatmicrotech.com

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