NEWS

新闻资讯

28

2015-12

2015

Registered and established on December 28, 2015
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2015

01

2018-01

2018

Completed factory construction
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2018

01

2019-01

2019

Mass production of the first domestic substrate fan-out packaging production line
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2019

01

2020-01

2020

Miniaturized discrete device packaging
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2020

01

2021-01

2021

Power management IC packaging
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2021
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