TVS
Package Size
DFN0402
DFN0603
DFN1006
DFN1610
DFN2010
DFN2510
DFN2626
DFN3020
DFN3333
DFN3810
DFN6525
DFN9580
DFN10096
Customer-customized dimensions
Structure Type
Single-chip co-planar structure
Single-chip heterostructure
MOS & TVS Integrated Packaging
IC & TVS Integrated Packaging
Multi-chip tiled structure
Multi-chip stacking structure
Product Features
DFN appearance
Flat lead and convex lead design
Can be exposed to tin on the side
High overcurrent capability
The chip size can be increased by 20% relative to the WB structure
Small packaging parasitic capacitance (<0.1pf)
High surge capability (1610: 240A/4.5V; 1006: 55A/12V)
Product Advantages
High Conductivity
Reliability
High Integration
Low Cost
Good Performance
Application Scenarios
High-performance computing
5G communication
Industrial equipment
Consumer electronics
Internet of Things
Automotive electronics
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