MOS
Package Size
DFN1006
DFN1212
DFN1509
DFN2020
DFN3030
DFN3333
DFN4040
CSP1313
CSP3820
QFN4040
QFN5050
QFN100100
Customer-customized dimensions
Structure Type
Single-MOS structure
Dual-MOS Structure
Multi-MOS integrated packaging
Dual MOS Stacking
Multi-MOS anisotropic stacking
MOS & IC Integrated Packaging
MOS & TVS Combined Package
Product Features
DFN appearance
Flat lead and convex lead design
Can be exposed to tin on the side
The chip size can be increased by 20% compared to the WB structure.
Low RDSON
High heat dissipation capacity
Smaller package size
Product Advantages
High Conductivity
Reliability
High Integration
Low Cost
Good Performance
Application Scenarios
High-performance computing
5G communication
Industrial equipment
Consumer electronics
Internet of Things
Automotive electronics
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