IC
Package Size
DFN0804
DFN1010
DFN1107
DFN1510
DFN1515
DFN2015
DFN2020
DFN2515
QFN2525
QFN1010
QFN2020
QFN3020
QFN3030
QFN4040
QFN5050
QFN6060
QFN8050
Customer-customized sizes
Structure Type
Single-chip, single-sided, single-layer RDL structure
Single-chip, single-sided, multi-layer RDL structure
Single-chip, double-sided, multi-layer RDL structure
Multi-IC Chip Packaging Structure
IC & TVS Combined Packaging Structure
IC & MOS Integrated Packaging Structure
Multi-chip tiled structure
Multi-chip co-directional stacking structure
Multi-chip anisotropic stacking structure
Product Features
Single core, multi-core sealing
Ultra-thin and ultra-small structure
Customizable package size
Customizable pin shape
Single-sided, double-sided RDL design
RDL shapes, thickness, and spacing can be flexibly configured.
Product Advantages
High Conductivity
Reliability
High Integration
Low Cost
Good Performance
Application Scenarios
High-performance computing
5G communication
Industrial equipment
Consumer electronics
Internet of Things
Automotive electronics
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