SIP
Package Size
MFP1311
MFP1612
MFP2015
MFP2525
MFP3030
MFP4030
MFP5540
MFP5050
MFP6060
MFP7070
MFP8080
MFP9080
MFP100100
MFP11070
MFP120120
MFP130100
MFP230240
MFP300180
Customer-customized sizes
Structure Type
Single-chip + Inductor Structure
Single-chip + Capacitor Structure
Single-chip + Crystal Oscillator Structure
Single-chip + LED structure
Multi-chip + Inductor Structure
Multi-chip + Resistor-Capacitor-Inductor Structure
Multi-chip + Transformer Structure
Multi-layer stacking + chiplet
Product Features
Customized design
High degree of integration
Flexible structure
Controllable package size
Integrated IC chip, discrete, and passive components in a single package
Improve LED display accuracy
Optimizable temperature-compensation performance for crystal oscillator products
Product Advantages
High Conductivity
Reliability
High Integration
Low Cost
Good Performance
Application Scenarios
High-performance computing
5G communication
Industrial equipment
Consumer electronics
Internet of Things
Automotive electronics
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