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25

2022-11


SiMa Microelectronics General Manager Tan Xiaochun: Substrate fan-out packaging technology and applications

Tan Xiaochun, General Manager of Hefei Si Mai Microelectronics Technology Co., Ltd., shared the characteristics and advantages of fan-out packaging structure, the opportunities and challenges facing fan-out packaging, and application cases of Hefei Si Mai's fan-out packaging in a presentation titled "Fan-out Packaging Technology and Applications".

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