10:15–10:17 Shenzhen Bay Chip Exhibition
2025-10-08

Keywords:
Smat Micro Technology
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10:15–10:17 Shenzhen Bay Chip Exhibition
Guiding Organization: China International Engineering Consulting Co., Ltd.
Organizing Entities: Shenzhen Semiconductor and Integrated Circuit Industry Alliance (SICA), Shenzhen Major Industry Investment Group Co., Ltd.
2025-10-08
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The China System-in-Package Conference is the largest and most influential international conference and exhibition in China focusing on system-in-package technology. It brings together top experts, scholars, business decision-makers, and engineers in the global SiP field to discuss technology trends, share the latest achievements, and showcase innovative products and solutions. It is an important platform for connecting the industrial chain and promoting cooperation.
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