Preview of the 9th China System-in-Package Conference (SiP Conference China 2025)
2025-07-18
The China System-in-Package Conference is the largest and most influential international conference and exhibition focusing on system-in-package technology in China. It brings together top experts, scholars, business decision-makers, and engineers in the global SiP field to explore technology trends, share the latest achievements, and showcase innovative products and solutions. It serves as an important platform for connecting the industry chain and promoting cooperation.
Hefei SiMai Technology Co., Ltd. is a high-tech enterprise focusing on advanced packaging and testing services for integrated circuits. The company is committed to providing global customers with comprehensive and cost-effective packaging solutions, including system-in-package (SiP), wafer-level packaging (WLP), Flip Chip, Bumping, and testing. SiMai Technology possesses advanced production equipment, an experienced technical team, and a rigorous quality management system. Its products are widely used in various fields, including communications, consumer electronics, automotive electronics, industrial control, and artificial intelligence. Driven by technological innovation and guided by customer needs, the company aims to become a world-class integrated circuit packaging and testing service provider.
Hall 1T36, Shenzhen Convention & Exhibition Center (Futian) invites you to learn more on-site!
Keywords:
Smat Micro Technology
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