NEWS


新闻资讯

01

2026-01


2026

Chiplet packaging series

12

2025-06


Comprehensive Analysis of Integrated Circuits: From Functionality to Fabrication, Mastering All Key Points

An integrated circuit, abbreviated as IC, is a circuit that integrates multiple commonly used electronic components, such as resistors, capacitors, and transistors, and their connecting lines, together through advanced semiconductor manufacturing processes. This circuit has specific functions and is widely used in various electronic devices.

20

2025-01


Nine Years of Silicon Journey, Surmounting the Peak of 'Heart'---Si-mai Technology Annual Meeting Successfully Held

As time marches on, January 17, 2025, arrived quietly, and the annual meeting of Si-mai Technology kicked off as scheduled. It was not merely a simple celebratory dinner, but a grand celebration where all Si-mai people joined hands to look forward to the future.

25

2022-11


SiMa Microelectronics General Manager Tan Xiaochun: Substrate fan-out packaging technology and applications

Tan Xiaochun, General Manager of Hefei Si Mai Microelectronics Technology Co., Ltd., shared the characteristics and advantages of fan-out packaging structure, the opportunities and challenges facing fan-out packaging, and application cases of Hefei Si Mai's fan-out packaging in a presentation titled "Fan-out Packaging Technology and Applications".

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