Products

产品类型
TVS

TVS

DFN appearance Flat lead and convex lead design Can be exposed to tin on the side High overcurrent capability The chip size can be increased by 20% relative to the WB structure Small packaging parasitic capacitance (<0.1pf)

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MOS

MOS

DFN appearance Flat lead and convex lead design Can be exposed to tin on the side Low RDSON High heat dissipation capacity Smaller package size

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IC

IC

Single core, multi-core sealing Ultra-thin and ultra-small structure Customizable package size Customizable pin shape Single-sided, double-sided RDL design

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SIP

SIP

Customized design High degree of integration Flexible structure Controllable package size Improve LED display accuracy

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CSP

CSP

Product six bread seal High air tightness High reliability High mechanical strength

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WeChat Official Account

WeChat Official Account

0086-17755163133 (Mr. Fu/Ben)

ben_fu@smatmicrotech.com

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